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14 Microns 6H Immersion Gold Multilayer PCB No Peeling off Black Solder Mask

BICHENG ENTERPRISE LIMITED
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14 Microns 6H Immersion Gold Multilayer PCB No Peeling off Black Solder Mask

Brand Name : Bicheng
Model Number : 2H127171XAO
Certification : UL ISO9000
Place of Origin : CHINA
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T Paytal
Supply Ability : 50000 piece per month
Delivery Time : 8 working day
Packaging Details : vacuum
LLaminate color : white
Laminate type : FR-4
co.logo : no
marking : no
legend type : KUANG SHUN
outer copper foil : >= 35 um
warp-twist : <=0.75%
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14 Microns 6H Immersion Gold Multilayer PCB No Peeling off Black Solder Mask


Specifications


ItemRequirementResultACCREJ
LaminateTypeFR-4FR-4
SupplierITEQITEQ
Board thickness1.6+/-10%mm1.58+/-1.64mm
Outer copper foil>=35 um42.37 um
Inner copper foil1/1 OZ1/1 OZ
Warp-twist<= 0.75%0.19%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCS & SSCS & SS
MarkingCo.logoAs requirementOK
UL.logo94V094V0
Date codeWWYYWWYY
Marking formAs requirementOK
LocationCS
Min line width (mil)77.2
Min line spacing (mil)5.55.3
Min ring width (mil)NANA
Solder MaskTypeKSM-S6189BK31KSM-S6189BK31
ColorBlackBlack
Thickness>=10 um13 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentENIGOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012COK
Solderability Test245℃ 5S 1 CycleOK
Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.950Y0.9500.9250.9750.950
21.600Y1.6001.5751.6251.600
33.200Y3.2003.1753.2253.200
40.900YY0.9000.8750.9250.900
51.000Y1.0000.9751.0251.000
61.050Y1.0501.0251.0751.050
71.500Y1.5001.4751.5251.500
81.300Y1.3001.2751.3251.300
93.300N3.3003.2753.3253.300
102.000N2.0001.9752.0252.000
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
193.8293.7593.8893.8693.88
2190.50190.54190.47190.47190.53
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC
E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points424All Open TestQualified
Failure
The first pass Qty96All short TestQualified
Failure
Reject Qty0 pcsThe first pass Rate100%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others0 PCSRepaired Qty0 PCSScrap0 PCS
Remark:
Microsection Analysis Report
purpose & ReqHole wallTrace
Copper>=20 umSurface copper35 um
Nickel>=0 umBase copper17 um
Au>=0 umV/X
Tin/Lead<=3.56 um
Roughness>=25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
124.53223.33223.39225.03224.31223.94224.0921.0922.009
225.40924.20924.26925.90925.18924.96824.96813.9414.04
324.35923.15923.31924.85924.13923.76923.91714.70714.807
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAuSpeciment Location
141.6711.6412.75.68
240.0512.7312.788.68
344.9812.2414.016.68
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.Meeting your printed circuit board needs from PCB prototyping to mass volume production.
2.ISO certified PCB manufacturing factory

3.100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal
4.stress test, reliability test, insulation resistance test and ionic contamination test etc


Applications

Bluetooth Adapter
Wifi Range Extender
Gps Navigation
Bluetooth Devices
Micro Usb
Gprs
Adapter
Phone Tracker
Wifi Repeater
Radar Detector
Bluetooth Receiver
Dongle
Wlan
Codec
Intercom
Power Inverter


DFM

Serial NO.ProcedureItemManufacturing capability
Large volume (S<100 m²)Middle volume (S<10 m²)Prototype(S<1m²)
35Solder mask (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )Maximum via-plug diameter0.5mm0.5mm0.5mm
36Min.width of solder mask bridgeGreen:5mil(35um)Green:4mil(35um)Green:4mil(35um)
37Yellow:5mil(35um)Yellow:4mil(35um)Yellow:4mil(35um)
38Blue:5mil(35um)Blue:4mil(35um)Blue:4mil(35um)
39Black:6mil(35um)Black:6mil(35um)Black:6mil(35um)
40White:6mil(35um)White:6mil(35um)White:6mil(35um)
41All of Matt:6milAll of Matt:6milAll of Matt:6mil
42Green:5mil(70um)Green:4mil(70um)Green:4mil(70um)
43Yellow:5mil(70um)Yellow:4mil(70um)Yellow:4mil(70um)
44Blue:5mil(70um)Blue:4mil(70um)Blue:4mil(70um)
45Black:6mil(70um)Black:6mil(70um)Black:6mil(70um)
46White:6mil(70um)White:6mil(70um)White:6mil(70um)
47Open solder mask4mil(35um)4mil(35um)3mil(35um)
48Solder mask coverage4mil(35um)4mil(35um)3mil(35um)
49Min.width of solder mask text9mil(35um)9mil(35um)8mil(35um)
50Min.thickness of Solder mask9um(35um)9um(35um)9um(35um)
51Max.thickness of solder mask30um(35um)30um(35um)30um(35um)
52SilkscreenMin.width of silkscreen text6mil6mil5mil
53Min.height of silkscreen text35mil35mil30mil
54Min.space from silkscreen to pads6mil6mil5mil
55Colour of silkscreenWhite, Black, Yellow
56Carbon inkCarbon ink covers conductor or pads14mil13mil12mil
57Mid distance from carbon ink to pads12mil11mil10mil
58Peelable maskPeelable mask covers conductor or pads8mil7mil6mil
59Min.distance from peelable mask to pads14mil13mil12mil
60Max.via-plug of Silk-screen method2.0mm2.0mm2.0mm
61Max. via-plug of aluminum foil method4.5mm4.5mm

4.5mm




FAQ


Do you sell cheap FR-1, CEM-1 PCB?
Yes, we just offer single sided PCB made of FR-1 and CEM-1. We also use punching tool for the contour for the mass production.


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