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Routing Round Multilayer PCB PSR -2000GT600D , HASL multilayer printed circuit board PCB

BICHENG ENTERPRISE LIMITED
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Routing Round Multilayer PCB PSR -2000GT600D , HASL multilayer printed circuit board PCB

Brand Name : BICHENG
Model Number : 4H125988XBO
Certification : UL
Place of Origin : CHINA
MOQ : 1 Piece
Price : Negotiable
Payment Terms : T/T
Supply Ability : 50000 Piece Per month
Delivery Time : 8 Working day
Packaging Details : Vacuum
Laminate Type : FR-4 TG170
Laminate Supplier : ITEQ
Board Thickness : 1.60+/- 10%
Outter Copper foil : >= 35 UM
Inner Copper foil : 1/1 OZ
Legend Color : White
Solder Mask Type : Green
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Routing Round Multilayer PCB PSR -2000GT600D , HASL multilayer printed circuit board PCB


Spetifications


ItemRequirementResultACCREJ
LaminateTypeFR-4 TG 170FR-4 TG170
SupplierITEQITEQ
Board thickness1.6+/-10%mm1.50+/-1.53mm
Outer copper foil>=35 um43.37um
Inner copper foil1/1 OZ1/1 OZ
Warp-twist<= 1%0.15%
legendTypeIJR-4000 MW300IJR-4000 MW300
ColorWhiteWhite
LocationCS & SSCS & SS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYYWWYY
Marking formNAOK
LocationCSCS
Min line width (mil)9.8410
Min line spacing (mil)76.8
Min ring width (mil)NANA
Solder MaskTypePSR-2000GT 600DPSR-2000GT 600D
ColorGreenGreen
Thickness>=10 um13 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentHASL Lead freeOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012COK
Solderability Test245℃ 5S 1 CycleOK
Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.610Y0.6000.5750.6250.600
20.890Y0.8750.8500.9000.875
31.020Y1.0251.0001.1501.025
41.125Y1.1251.1001.1501.150
52.110Y2.1002.0752.1252.100
62.490Y2.4752.4502.5002.475
73.200Y3.2003.1753.2253.200
83.500N3.5003.4753.5253.500
96.500N6.5006.5256.5256.500
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1101.93101.96101.96102.02101.95
2393.70393.81393.66393.64393.77
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points968All Open TestQualified
Failure
The first pass Qty115All short TestQualified
Failure
Reject Qty0 pcsThe first pass Rate100%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others0 PCSRepaired Qty0 PCSScrap0 PCS
Remark:
Microsection Analysis Report
purpose & ReqHole wallTrace
Copper>=20 umSurface copper35 um
Nickel>=0 umBase copper17 um
Au>=0 umV/X
Tin/Lead<=3.56 um
Roughness>=25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
125.87124.67124.73125.65125.28126.37125.42913.91314.013
226.69325.49525.55526.47526.10527.19526.25416.02616.126
324.04222.84222.90223.82223.45224.54223.60117.91818.018
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
144.1618.8713.473.440.1031
244.717.1213.333.470.1061
342.818.1913.73.590.1091
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages
1.Save the cost of production: Production cost is one of the key points of our customers’ product competitiveness. Bicheng PCB have been striving to reduce its manufacturing
cost from equipment introduce, worker training and technology improvement to increase their profitability. Customers are satisfied with our cost savings but without quality loss.
Repeater Wifi
2.Gps Tracker For KidsBluetooth Usb AdapterCar Tracking Device
3.Bluetooth Adapter For PC

4.Avoid hassle: It’s an upset matter when quality problem hassling you. Bicheng engineering design prevents problem from occurring in pre-production. You will not get headache


Applications

Automation
Wifi Adapter
Usb Wifi
Wireless Routers
Splitter
Dc Motor
Usb Wifi Adapter
Satellite Radio
Modem Router
Car Amplifier
Wifi Antenna
Servo Motor
Electric Motor
Transmitter
Dsl Modem
Preamplifier
Gps Tracking Device


Performance parameter of MCPCB substrate (The parameter will continue to be improved without notice)

Test itemUnitAluminum baseCopper baseIron baseTest method
Actual valeActual valeActual vale
Peel strengthN/mm2.222.34010 of GJB1651
Surface resistance1 x (10^6)1 x (10^6)1 x (10^6)5020 of GJB1651
Volume resistanceMΩ.m3.2 x (10^7)3.2 x (10^7)3.2 x (10^7)5020 of GJB1651
Breakdown voltageKV/min≥2.0 (Breakdown voltage is adjustable according to customers' demend)≥1.0 (Breakdown voltage is adjustable according to customers' demend)≥1.0 (Breakdown voltage is adjustable according to customers' demend)5040 of GJB1651
Solder dipping℃/min260℃, 3 minutes, no bubble and delamination260℃, 3 minutes, no bubble and delamination260℃, 3 minutes, no bubble and delamination4010 of GJB1651
Flammability-FV-0FV-0FV-017 of GB/T4722
Thermal resistance℃/W0.25-1.20.25-1.20.25-1.2TO-220
Dielectric constant-333(40℃,93%,96h)
Thermal conductivity of DielectricW/M.K0.8-80.8-3500.8-3ASTM 5470-D
Working temperature≤120≤120≤120(40℃,93%,1Y)
Thermal conductivity of metal baseW/M.K≥200≥350≥45ASTM


FAQ


Do you sell high temperature PCB?
Yes. The material stability of high Tg (glass transition temperature) is high so that a high Tg PCB can be desirable. Multilayer and high layer PCB use this material much.


Product Tags:

circuit board prototyping

      

prototype pcb board

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

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