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Double sided 3oz copper PCB Onstatic Blue PCB Shengyi FR-4 Tg170 PCB HASL Lead free

BICHENG ENTERPRISE LIMITED
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Double sided 3oz copper PCB Onstatic Blue PCB Shengyi FR-4 Tg170 PCB HASL Lead free

Brand Name : BICHENG
Model Number : 12I119812xb1
Certification : UL
Place of Origin : China
MOQ : 1 Piece
Price : Negotiable
Payment Terms : T/T
Supply Ability : 50000 Piece per month
Delivery Time : 8 Wirking day
Packaging Details : Vacuum
Laminate Type : FR4:CTI:175V-249V
Outer Copper foil : > 35um
Inner Copper foil : 1/1 oz
Legend Color : white
Min .Line Width : 5.9
Solder Mask Color : Blue
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Double sided 3oz copper PCB Onstatic Blue PCB Shengyi FR-4 Tg170 PCB HASL Lead free


Specifications

ItemDescriptionRequirementActualResult
LaminateLaminate TypeFR4:CTI:175V-249VFR4:CTI:175V-249VACC
SupplierSHENGYISHENGYIACC
Tg170170ACC
Finished thickness1.57+/-0.15 MM1.657MMACC
Plating thicknessPTH Cu thickness20 um22.87umACC
Inner layer Cu Thickness//ACC
Surface Cu thickness105 um107.10 umACC
Solder MaskMaterial typeR-500 BLR-500 BLACC
SupplierONSTATICONSTATICACC
ColorBlueBlueACC
Single / both sidesBoth SidesBoth SidesACC
S/M thickness>= 10.0 um25.2 umACC
3M tape testNO Peel OffNo peel offACC
LegendMaterial typeS-380WS-380wACC
SupplierTai yoTai yoACC
ColorWhiteWhiteACC
LocationCSCSACC
3M tape testNo peel offNO peel offACC
CircuitTrace Width (mm)0.25+/-20%mm0.255mmACC
Spacing (mm)0.38+/- 20%mm0.375 mmACC
IdentificationUL mark94V-094V-0ACC
Company LogoQMQMACC
Date code11171117ACC
Mark locationCSCSACC
Surface treatmentENIGNickel//ACC
Gold//ACC
Gold fingerGF Nickel//ACC
GF Gold//ACC
Immersion silver//ACC
immersion tin//ACC
HASL//ACC
Lead- free HASL>3.85um6.21umACC
OSP
Reliabilty TestsThermal shock test288±5℃, 10sec ,3 cyclesNO Discolor , NO DelaminationACC
solder abllity test235±5℃100% WettingACC
FunctionElectrioal Test100%passACC
StandardIPC-A 600H class 2, IPC_6012C CLASS 2100%PassACC
AppearanceVisual inspection100%PassACC
warp and twist<= 0.75%0.21%ACC
OthersV-Cut thickness//ACC
Angle//ACC

Outline Dimension Report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTH/NPTHActual dimensionACCREJ
10.90Y0.9000.8750.9250.900ACC
21.02Y0.9751.0251.0001.025ACC
31.30Y1.3251.3001.3251.300ACC
43.05Y3.0503.0253.0503.025ACC
Outline dimension unit:(mm, tolerance +/-0.13mm)
NORequiredActual dimensionACCREJ
1190189.97189.96189.97189.94189.97ACC
2128127.96127.95127.96127.95127.96ACC
Reference engimeering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

Microsection Report
1. Hole Wall Copper thickness (um)Hole wall Roughness<= 25.4 um
Hole wall Copper Thickness23 um
Hole wall Position (um)ABCDEFAveDrilPlate
12320.3321.52620.332622.8617.782.54
22320.4262620.332623.6213.9713.97
32220.5222220.292622.1317.782.54
2.Surface & Inner layer Cu Thickness & Dielectric Thickness (um)
Layer NO.RequiredResultDescriptionLayer NO.Requirement thicknessresultDescription
NO1NO2NO3NO4
L13544.3ACCL1-L215001452.6ACC
L23541.9ACC
3.Solder mask Thickness
On Laminateconductor surfaceconductor cornerDescription
Measurement Result39.625.216.6ACC

Advantages

1.Engineering design prevents problems from occurring in pre production.

2.Products and Manufacturing are certified by authorized organizations.

3. 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal

stress test, reliability test, insulation resistance test and ionic contamination test etc.

4. Eligible products rate of first production: >95%


Applications

Embedded Linux

Contract Manufacturing

Wireless Adapter For Desktop

Wholesale Electronics

24 Port Switch

Layer 3 Switch

Dvi Switch

Electronics Components

Phone Tracking

Spread Spectrum

Broadband Router

Gsm Gateway


Image Transfer

As PCBs become more complex, patterns (pads and tracks) are becoming finer and finer. It is very crucial to transfer the image without any noticeable distortion. The finished image will act as a plating resist. This is usually based on a dry-film resist of a certain thickness that matches the plating thickness.

The most commonly used track width is about 0.102 mm (4 mils) which could be regarded as the standard width. However, widths of 0.076 mm (3 mils) are also in use, and some Chinese PCB manufacturers operate with track widths down to 0.050 mm (2 mils). But the PCB designer should not be tempted by track widths of 0.076 mm (3 mils) or smaller because the manufacturing yield becomes lower and the board price.correspondingly. higher.

The purpose of image transfer is to cover those areas of the board that are not to be plated with copper. n/lead or pure tin.with a plating resist. and to leave the pattern open for electroplating. With plated-through-hole boards.image transfer is performed by means of a photopolymer dry-film process consists of the following steps:

1.Laminations

2.Laser Direct Imaging


FAQ

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