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White Silkcreen Text Milling Contour Heavy Copper PCB 3.2mm Thick Warp Less than 0.08%

BICHENG ENTERPRISE LIMITED
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White Silkcreen Text Milling Contour Heavy Copper PCB 3.2mm Thick Warp Less than 0.08%

Brand Name : Bicheng
Model Number : BIC-3213-B
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Supplier : ITEQ
Type : KUANG SHUN
Location : CS & SS
Thickness : >=10 um
Visual inspection : IPC-A-600H&IPC-6012B
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HASL Blue 3oz PCB White Silkcreen Text Milling Contour PCB 3.2mm Thick Warp Less than 0.08%


Specifications

ItemRequirementResultACCREJ
LaminateTypeFR-4FR-4
SupplierITEQITEQ
Board thickness3.20±10%mm3.19-3.21mm
Outer copper foil>=105 um123.37um
Inner copper foil//
Warp-twist<= 0.75%0.08%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCS & SSCS & SS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYYWWYY
Marking formNAOK
LocationCSCS
Min line width (mil)1010.2
Min line spacing (mil)6.56.3
Min ring width (mil)NANA/
Solder MaskTypeR-500 BLR-500 BL
ColorBlueBlue
Thickness>=10 um13 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentLead free HASLOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012BOK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.600±0.076Y0.6000.5750.6250.600
20.900±0.076Y0.9000.8750.9250.900
30.950±0.076Y0.9500.9250.9750.950
41.000±0.076Y1.0000.9751.0251.000
51.050±0.076Y1.0501.0251.0751.050
61.100±0.076Y1.0001.0751.1251.100
71.150±0.076Y1.1501.1251.1751.150
81.350±0.076Y1.3501.3251.3751.350
91.600±0.076Y1.6001.5751.6251.600
101.650±0.076Y1.6501.6251.6751.650
111.700±0.076Y1.7001.6751.7251.700
121.850±0.076Y1.8501.8251.8751.850
133.200±0.076Y3.2003.1753.2253.200
143.300±0.076Y3.3003.2753.3253.300
153.350±0.076Y3.3503.3253.3753.350
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1198.12±0.15198.01198.20198.23198.11
2103.98±0.15104.05104.04104.07104.09
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points1304All Open TestQualified
Failure
The first pass Qty125 PCSAll short TestQualified
Failure
Reject Qty1 pcsThe first pass Rate99%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others1 PCSRepaired Qty0 PCSScrap1 PCS
Remark:

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper35 um
Nickel0 umBase copper17 um
Au0 umV/X
Tin/Lead3.62 um
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
126.21125.01125.07126.71125.99125.62117.53217.53217.632
225.66224.46224.52226.16225.44225.22019.21719.21719.317
325.51624.31624.37626.01625.29625.07420.61820.61820.718
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
140.8417.4112.284.65
242.0318.0012.397.65
343.1817.7915.495.65
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.Save time: Market requires the products updating quickly. Bicheng PCB always works fast and flexible to save the time of production from prototype to standard production,quick turn-around or scheduled deliveries.

2.RoHS materials.

3.Professional and experienced engineers.

4.Quick and on-time delivery.


More Applications

Satellite Lnb
3G Repeater
Wireless Printer Adapter
Directional Wifi Antenna
Rv Inverter
Gps Gsm Tracker
Access Point Wireless
2000W Inverter
Blue Tooth Adapter
24 Volt Inverter
Burglar Alarm Systems
Gps Tracking Chip
Dc Transformer
Data Logging
Smps Power Supply
Dual Power Supply


PCB Production Process

1. Contact PCB fabricator

Contact your satisfied vendor such as Bicheng. You’re registered and will be quoted for you. Place your order and follow up the production schedule.


2. Material cutting

Purpose: According to the requirement from engineering data, cut the large plate which is in compliance with the requirement into small pieces of production board piece to meet customer requirements of the small sheet.

3. Drill

Purpose: According to the requirement from engineering data, drill all the holes.


4. Copper deposition

Purpose: Copper deposition is a thin copper deposit on the wall of the insulating hole by chemical method


5. Pattern transfer

Purpose: Pattern transfer is the transfer of image production on the film to the board


6. Pattern plating

Purpose: Pattern electroplating is a layer of copper or gold over nickel or tin that requires a thickness plated on the exposed copper of the pattern graphic or on the hole wall.


7. Film stripping

Purpose: The NaOH solution is used to strip the anti-plating film to expose the non-pattern circuit layer.


8. Etching

Purpose: Etching is to etch off the non-circuit parts of the copper layer by chemical reaction method


9. Solder Mask

Purpose: Solder mask is transferring the solder mask film graphics to the board to protect the track and prevent the track from the effect of tin welding during assembly.


10. Silkscreen

Purpose: The silkscreen character is a mark that is easy to recognize.


11. Edge connector plating (Gold finger)

Purpose: A nickel gold layer with a thickness is plated on the PCB edge of the plug to make it more resistant to wear.


HASL (a process of coordinate)

HASL is a layer of tin generated on the non-solder mask area to protect pad copper surface from oxidation to ensure good welding performance.


12. Contour

Purpose: By stamping or milling machine to cut the PCB into customers' required shape.


13. Electrical test

Purpose: Through the electronic 100% test to find the open circuit, short circuit and other functional defects which are not easy to find by visual inspection.


14. Final Inspection

Purpose: Through 100% visual inspection to find out the defects in appearance and repair minor defects to avoid problems and defects in the shipment.



FAQ

1.Do you sell MCPCB?
Yes. We offer metal core PCB(MCPCB), single sided and double sided, aluminum core and copper core, 1W/MK, 2W/MK and 3W/MK etc.

2.Do you sell impedance controlled PCB?
Yes. Impedance controlled PCB's are used more and more popular in our common life. We can offer differential impedance and single end impedance PCB.



Product Tags:

copper pcb board

      

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