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Electrolytic Gold Keypad Hard Gold Double Sided PCB 2 Layer CNC Routing

BICHENG ENTERPRISE LIMITED
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Electrolytic Gold Keypad Hard Gold Double Sided PCB 2 Layer CNC Routing

Brand Name : Bicheng
Model Number : BIC-1429-A
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Laminate Type : FR4 TG≧170: CTI:175V-249V
Inner layer Cu Thickness : 1/1 OZ
Supplier : Tai yo
UL mark : 94V-0
Mark location : CS
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Electrolytic Gold PCB Keypad Hard Gold PCB 1.6mm Thick Double Layer PCB CNC Routing PCB


Specifications

ItemDescriptionRequirementActualResult
ACCREJ
LaminateLaminate TypeFR4 TG≧170: CTI:175V-249VFR4 TG≧170: CTI:175V-249VACC
Supplier//ACC
TgTG ≧170TG ≧170ACC
Finished thickness1.6+/-10% MM1.57 MMACC
Plating thicknessPTH Cu thickness>20 um22.13umACC
Inner layer Cu Thickness1/1 OZ1/1 OZACC
Surface Cu thickness35 um45.1 umACC
Solder MaskMaterial typeLP-4G G-05LP-4G G-05ACC
SupplierNan YaNan YaACC
ColorGreenGreenACC
Single / both sidesBoth SidesBoth SidesACC
S/M thickness>=10.0 um26.93 umACC
3M tape testNO Peel Offno peel offACC
LegendMaterial typeS-380WS-380wACC
SupplierTai yoTai yoACC
ColorWhiteWhiteACC
LocationBoth SidesBoth SidesACC
3M tape testNo peel offno peel offACC
CircuitTrace Width (mm)0.203+/-20%mm0.195mmACC
Spacing (mm)0.203+/- 20%mm0.199 mmACC
IdentificationUL mark94V-094V-0ACC
Company LogoQM2QM2ACC
Date code08 1708 17ACC
Mark locationCSCSACC
Surface treatmentElectrolytic GoldNickel100u"112u"ACC
Gold1u"1.11u"ACC
Gold fingerGF Nickel
GF Gold
Immersion silver
immersion tin
HASL
Lead- free HASL
OSP
Reliabilty TestsThermal shock test288±5℃, 10sec ,3 cyclesNO Discolor , NO DelaminationACC
solder abllity test245±5℃100% wettingACC
FunctionElectrioal Test100%passACC
StandardIPC-A 600H class 2, IPC_6012C CLASS 2100%PassACC
AppearanceVisual inspection100%PassACC
warp and twist<= 0.75%0.26%ACC
OthersV-Cut thickness0.4±0.1 mm0.41mmACC
Angle30+/- 530ºACC

Outline Dimension Report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTH/NPTHActual dimensionACCREJ
10.500*1.00+/-0.075Y0.500*1.000.500*1.000.500*1.000.500*1.00ACC
20.508+/-0.075Y0.4750.4500.4500.475ACC
30.610+/-0.075Y0.6000.6000.6250.675ACC
40.700+/-0.05N0.7250.7250.7500.725ACC
50.711+/-0.075Y0.6750.6750.6750.650ACC
60.914+/-0.075Y0.9750.8750.9750.975ACC
71.118+/-0.05N1.1251.1001.1751.175ACC
81.219+/-0.05N1.2501.1751.2001.250ACC
91.524+/-0.05N1.5501.5751.5501.550ACC
101.600+/-0.05N1.6251.5751.6251.625ACC
112.540+/-0.075Y2.4752.5502.5002.575ACC
122.997+/-0.075Y3.0502.9503.0003.025ACC
133.500+/-0.05N3.5503.4503.5503.550ACC
Outline dimension unit:(mm, tolerance +/-0.13mm)
NORequiredActual dimensionACCREJ
1168.38+/-0.13168.25168.25168.34168.34168.35ACC
273.34+/-0.1373.2173.2173.373.3073.31ACC
384.19+/-0.1384.0684.0684.1584.1584.16ACC
453.34+/-0.1353.2153.2153.3053.3053.31ACC
Reference engimeering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

Microsection Report
1. Hole Wall Copper thickness (um)Hole wall Roughness<= 25.4 um
Hole wall Copper Thickness23 um
Hole wall Position (um)ABCDEFAveDrilPlate
121.5020.4021.5026.0020.3322.0021.9617.7817.78
222.0020.5026.0021.5020.3323.0022.2213.972.54
322.0020.3323.0021.5020.5026.0022.2217.7817.78
2.Surface & Inner layer Cu Thickness & Dielectric Thickness (um)
Layer NO.RequiredResultDescriptionLayer NO.Requirement thicknessresultDescription
NO1NO2NO3NO4
L13545.1ACCL1-L2195191.1ACC
L23528.5ACCL2-L3410405.6ACC
L33528.8ACCL3-L4250252.3ACC
L43528.8ACCL4-L5410409.5ACC
L53527.9ACCL5-L6195189.3ACC
L63544.7ACC
3.Solder mask Thickness
On Laminateconductor surfaceconductor cornerDescription
Measurement Result39.225.516.1ACC

Advantages

1.No MOQ, low cost for small quantity prototypes and samples.

2.PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.

3.Engineering design prevents problems from occurring in pre production.

4.Customer complaint rate: <1%.


More Application

Switch Lan
Embedded Systems Pdf
Pcb Etching
Car Tracking System
Led Light Kits
Vehicle Gps
Media Access Control
Door Entry Systems
Poe Switches
Wireless Cctv Systems
Motor Drive
Router 3G Wifi


ENIG

ENIG has several advantages than HASL, including

a) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

b) Good oxidation resistance and good heat dissipation.

c) Long storage time (It can be stored for more than 1 year in vacuum bag)

d) High solderability, no stressing of circuit boards and less contamination of PCB surface.



FAQ

1.Where do you sell your PCBs?
We sell our PCB's world widely.
North America, Oceania, Southeast Asia, Eastern Europe, Africa, Latin America, Western & Southern Europe, Northern Europe, Central & South Asian, and Middle East.

2.Where do I send my gerber files?
Your files are emailed to the sales representative who wills reviews the files and provides a quote based on your lead time and quantity requirements.
If you're contact us first time, you can send enquiries to our market department at rfq@bicheng-enterprise.com
You can also contact us through the website contact form in the pages.



Product Tags:

circuit board prototyping

      

prototype pcb board

      
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