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Green 10 Layer Pcb Prototype Service 2.0mm Thick 1oz Each Layer Fr -4 Shengyi Material

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Green 10 Layer Pcb Prototype Service 2.0mm Thick 1oz Each Layer Fr -4 Shengyi Material

Brand Name : Bicheng
Model Number : BIC-6584-V
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Material type : LP-4G G-05
Color : Green
UL mark : 94V-0
solder abllity test : 245±5℃
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Green 10 Layer Pcb Prototype Service 2.0mm Thick 1oz Each Layer Fr -4 Shengyi Material


Specifications


ItemDescriptionRequirementActualResult
ACCREJ
LaminateLaminate TypeFR4FR4ACC
SupplierSHENGYISHENGYIACC
TgTG ≧170TG ≧170ACC
Finished thickness2.0+/-10% MM2.03MMACC
Plating thicknessPTH Cu thickness>20 um22.12umACC
Inner layer Cu Thickness1/1 OZ1/1 OZACC
Surface Cu thickness35 um46.8 umACC
Solder MaskMaterial typeLP-4G G-05LP-4G G-05ACC
SupplierNan YaNan YaACC
ColorGreenGreenACC
Single / both sidesBoth SidesBoth SidesACC
S/M thickness>=10.0 um28.57 umACC
3M tape testNO Peel Offno peel offACC
LegendMaterial typeS-380WS-380wACC
SupplierTai yoTai yoACC
ColorWhiteWhiteACC
LocationBoth SidesBoth SidesACC
3M tape testNo peel offno peel offACC
CircuitTrace Width (mm)0.203+/-20%mm0.208mmACC
Spacing (mm)0.203+/- 20%mm0.198 mmACC
IdentificationUL mark94V-094V-0ACC
Company LogoQM2QM2ACC
Date code10171017ACC
Mark locationCSCSACC
Surface treatmentENIGNickel100U''137.6U''ACC
Gold≧1.2U''1.26U''ACC
Gold fingerGF Nickel
GF Gold
Immersion silver
immersion tin
HASL
Lead- free HASL
OSP
Reliabilty TestsThermal shock test288±5℃, 10sec ,3 cyclesNO Discolor , NO DelaminationACC
solder abllity test245±5℃100% wettingACC
FunctionElectrioal Test233+/-5℃100wettingACC
StandardIPC-A 600H class 2, IPC_6012C CLASS 2100%PassACC
AppearanceVisual inspection100%PassACC
warp and twist<= 0.75%0.25%ACC
OthersV-Cut thickness0.4±0.1 mm0.39mmACC
Angle30+/- 530ºACC

Outline Dimension Report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTH/NPTHActual dimensionACCREJ
10.500*1.00+/-0.075Y0.475*1.00.5*0.9750.475*1.00.5*0.975ACC
20.508+/-0.075Y0.5500.4750.5750.500ACC
30.610+/-0.075Y0.6000.6500.6750.575ACC
40.700+/-0.075N0.6500.6500.7500.700ACC
50.711+/-0.075Y0.7750.7000.7500.775ACC
60.914+/-0.075Y0.9750.9750.8750.975ACC
71.118+/-0.075N1.1251.1501.1751.150ACC
81.219+/-0.075N1.2251.2751.2501.250ACC
91.524+/-0.075N1.4751.5501.5251.550ACC
101.600+/-0.075N1.6501.6001.6501.575ACC
112.540+/-0.075Y2.5252.6002.5252.600ACC
122.997+/-0.075Y2.9503.0503.0002.950ACC
133.500+/-0.075N3.5503.5503.5503.500ACC
Outline dimension unit:(mm, tolerance +/-0.13mm)
NORequiredActual dimensionACCREJ
1168.38+/-0.13168.25168.34168.34168.25168.25ACC
273.34+/-0.1373.2173.3073.3073.2173.21ACC
Reference engimeering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

Microsection Report
1. Hole Wall Copper thickness (um)Hole wall Roughness<= 25.4 um
Hole wall Copper Thickness23 um
Hole wall Position (um)ABCDEFAveDrilPlate
126.0020.3321.5021.5020.3323.0022.112.5413.97
222.0020.3321.5022.0020.4023.0021.542.5413.97
326.0020.3326.0022.0020.5021.5022.7213.9717.78
2.Surface & Inner layer Cu Thickness & Dielectric Thickness (um)
Layer NO.RequiredResultDescriptionLayer NO.Requirement thicknessresultDescription
NO1NO2NO3NO4
L13546.8ACCL1-L2195191.5ACC
L23528.3ACCL2-L3410408.3ACC
L33528.1ACCL3-L4250244.2ACC
L43528.5ACCL4-L5410412.5
L53528.7ACCL5-L6195188.4
L63547.2ACC
3.Solder mask Thickness
On Laminateconductor surfaceconductor cornerDescription
Measurement Result40.825.319.6ACC

Advantages

1.PCB manufacturing on required specifications. Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
2.Meeting your printed circuit board needs from PCB prototyping to mass volume production.
3.ISO certified PCB manufacturing factory.


More Application

Ac Power Source
Modem Router 3G
Ac Dc Power
Convert Dc To Ac
220V Inverter
Ac Power Inverter
Wireless G Router
Inverter 220V
3G Роутер
Sms Modem
Embedded Controller
Process Controller


Impedance controlled PCB

Basic elements to impedance control
  1. Thickness of trace (T1) 7%
  1. Width of trace (W1) 4%
  1. Height of laminate (H1) 35%
  1. Dielectric constant of board material (Er1) 8%

Other factors can be involved, however they have much less affect on the impedance such solder resist, thickness of tin and lead, PCB humidity etc

Main factors affected impedance control (normally ±10%)
  1. Generally, designed width of trace is already fixed, manufacturing procedure is controlled within ±15-20%
  1. Generally, the thickness of trace is already fixed at designing period, manufacturing procedure of electroplate is controlled within ±0.8-1.2mil
  1. The dielectric constant of the substrate is almost fixed, no much big changes.
  1. The above-mentioned factors can be controlled stably, the main affecting factor of impedance control is only left height of laminate.
Main factors to the height of laminate
  1. thickness of inner layer copper
  1. residual rate of inner layer copper
  1. use which kind of prepreg


FAQ


Do you sell BGA circuit board?
Yes. We offer micro fine pitch BGA circuit boards. The minimum pad diameter of BGA is 10mil for prototypes, 12mil for mass production.


Product Tags:

circuit board prototyping

      

prototype pcb board

      
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