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Hot Air Soldering Level HASL PCB 1.52-1.56mm thick with Date Code 0717

BICHENG ENTERPRISE LIMITED
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Hot Air Soldering Level HASL PCB 1.52-1.56mm thick with Date Code 0717

Brand Name : Bicheng
Model Number : BIC-1002-C
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Laminate Type : FR-4 TG170
Color : Green
Surface treament : HASL Lead free
Solderability Test : 245℃ 5S 1 Cycle
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Hot Air Soldering Level HASL PCB 1.52-1.56mm thick with Date Code 0717


Specifications


ItemRequirementResultACCREJ
LaminateTypeFR-4 TG170FR-4 TG170
SupplierITEQITEQ
Board thickness1.60±10%mm1.52-1.56mm
Outer copper foil>=35 um41.53
Inner copper foil1/1 OZ1/1 OZ
Warp-twist<= 1%0.71%
legendTypeKUANG SHUNKUANG SHUN
ColorWhiteWhite
LocationCSCS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYY0 717
Marking form//
LocationCSCS
Min line width (mil)66.2
Min line spacing (mil)65.8
Min ring width (mil)NANA/
Solder MaskTypeKUANG SHUNKUANG SHUN
ColorGreenGreen
Thickness>=10 um14 um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentHASL Lead freeOK
Special TreamentSilk screen//
Location//
FormingV-cutOK
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012BOK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.610±0.076Y0.6250.6000.6500.625
20.760±0.076Y0.7750.7500.8000.775
30.810±0.076Y0.8250.8000.8500.825
40.860±0.076Y0.8750.8500.9000.0875
50.910±0.076Y0.9250.9000.9500.925
60.960±0.076Y0.9500.9250.9750.950
71.000±0.076Y1.0000.9751.0251.000
81.140±0.076Y1.1501.1251.1751.150
91.220±0.076Y1.2501.2251.2751.250
101.320±0.076Y1.3501.3251.3751.350
111.400±0.076Y1.4001.3751.4251.400
121.600±0.076Y1.6001.5751.6251.600
131.700±0.076Y1.7001.6751.7251.700
142.030±0.076Y2.0502.0252.0752.050
152.540±0.076Y2.5502.5202.5752.550
163.000±0.076Y3.0002.9753.0253.000
173.200±0.076Y3.2003.1753.2253.200
183.500±0.076Y3.5003.5253.5753.500
191.520±0.076N1.5201.4951.5451.520
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1164.77±0.15164.68164.88164.71164.68
2378.46±0.15378.42378.56378.39378.53
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points2312All Open TestQualified
Failure
The first pass Qty120 PCSAll short TestQualified
Failure
Reject Qty0 pcsThe first pass Rate100%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others0 PCSRepaired Qty0 PCSScrap0 PCS
Remark:

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper35 um
Nickel3.56 umBase copper11 um
Au0.05 umV/X
Tin/Lead0 um
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
124.08022.88022.94024.58023.86023.49023.63815.49415.594
224.17422.97423.03424.67423.95423.58423.73314.71314.813
326.79725.59725.65727.29726.57726.20726.35515.70515.805
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
140.4910.5013.843.830.0562
241.0912.5313.803.860.0592
343.0210.9515.533.980.0622
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.DDU Door to door shipment with competitive shipping cost. You don’t need to arrange anything after confirming the order. Just wait for your PCB delivery to your hand.

2. Engineering design prevents problems from occurring in pre production.
3. Products and Manufacturing are certified by authorized organizations.
4. 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.


More Application

Umts Modem
Antenna Wireless
Routeur 3G
Tp Link 3G Router
Gsm Gprs
Voltage Converters
Cellular Repeater
Wifi Directional Antenna
Laptop Wifi Antenna
Mobil Router
Huawei Usb Modem
3G Technology
Variable Frequency Drives
Display Drivers


PCB Bow and Warpage

The value B shall be less than 0.75% of the diagonal of the panel.



FAQ


What kind of file format do you accept? only gerber files? aceept eagle .brd files?
Gerber files are our first choice. We also accept .PCB files and .PCBDOC files. We currently do not use .brd files.


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