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2oz Each Layer 4 Layer PCB FR-4 ITEQ 2.4mm Thick Chemicla Gold Finish

BICHENG ENTERPRISE LIMITED
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2oz Each Layer 4 Layer PCB FR-4 ITEQ 2.4mm Thick Chemicla Gold Finish

Brand Name : Bicheng
Model Number : BIC-0911-B
Certification : UL
Place of Origin : China
MOQ : 1 piece
Price : Negotiable
Payment Terms : T/T,Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 8 working days
Packaging Details : vaccum
Supplier : ITEQ
Solder Mask Type : KSM-S6819BLM1
Surface treament : Immersion Gold
Electrical test : 100% PCB passed
Location : CS & SS
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2oz Each Layer 4 Layer PCB FR-4 ITEQ 2.4mm Thick Chemicla Gold Finish


Specifications

ItemRequirementResultACCREJ
LaminateTypeFR-4FR-4
SupplierITEQITEQ
Board thickness2.36±10% mm2.45-2.59 mm
Outer copper foil>=70 um77.5um
Inner copper foil2/2 OZ2/2 OZ
Warp-twist<= 0.75%0.48%
legendTypeIJR-4000 MW300IJR-4000 MW300
ColorWhiteWhite
LocationCS & SSCS & SS
MarkingCo.logoYESOK
UL.logoYESOK
Date codeWWYYWWYY
Marking formNAOK
LocationCSCS
Min line width (mil)1212.2
Min line spacing (mil)76.8
Min ring width (mil)NANA/
Solder MaskTypeKSM-S6819BLM1KSM-S6819BLM1
ColorGreenGreen
Thickness>=10 um14um
Pencil Test6H OR ABOVEOK
SOLVENT TESTNO ATTACKOK
TAPE TESTNO PEEL OFFOK
Surface treamentImmersion GoldOK
Special TreamentSilk screen//
Location//
Forming//
Normal TestingElectrical test100% PCB passedOK
Visual inspectionIPC-A-600H&IPC-6012COK
Solderability Test245℃ 5S 1 CycleOK

Final inspection report
Hole size and slot dimension(unit: mm, PTH tolerance +/-0.076, NPTH +/-0.05mm)
NORequiredPTHActual dimensionACCREJ
10.700±0.076Y0.7000.6750.7250.700
20.850±0.076Y0.8500.8250.8750.850
30.900±0.076Y0.9000.8750.9250.900
41.000±0.076Y1.0000.9751.0251.000
51.400±0.076Y1.4001.3751.4251.400
61.500±0.076Y1.5001.4751.5251.500
72.800±0.076Y2.8002.7752.8252.800
83.950±0.076Y3.9503.9253.9753.950
V-CUT Finish dimension (unit: mm): including
NORequired Dimension (tolerance)Actual dimensinACCREJ
1226.06±0.15226.08225.96226.03226.11
2134.62±0.15134.65134.55134.64134.65
Reference engineering information
Hole drill drawingACC
Conductor and filmACC
Solder mask and filmACC
Legend and filmACC
Engineering changingACC

E-test Report
Test TypeGeneralTest Parameter
SpecialTest Votage250V
Single mouldTest Curent100 m A
Double mouldConducting Resistance20 M ohm
Flying probe TestIsolated Resistance20 M ohm
Test Points800All Open TestQualified
Failure
The first pass Qty20All short TestQualified
Failure
Reject Qty0 pcsThe first pass Rate100%
Mian Dwfect Desciption:
1Open Qty0 PCSRepaired Qty0 PCSScrap0 PCS
2Short Qty0 PCSRepaired Qty0 PCSScrap0 PCS
3Con. Defect0 PCSRepaired Qty0 PCSScrap0 PCS
4Isolated Defect0 PCSRepaired Qty0 PCSScrap0 PCS
5Others0 PCSRepaired Qty0 PCSScrap0 PCS
Remark:

Microsection Analysis Report
purpose & ReqHole wallTrace
Copper20 umSurface copper70 um
Nickel0 umBase copper53 um
Au0 umV/X
Tin/Lead4.23 um
Roughness25 um
Hole wall position Unit: umABCDEFAverageRoughnessSpeciment Location
DrillPlated
125.46024.26024.32025.96025.24024.87025.01813.21713.317
225.73424.53424.59426.23425.51425.14425.29215.71515.815
326.86625.66625.72627.36626.64626.27626.42514.57914.679
Trace CopperBase CopperSolder mask thicknessT/L THKNi THKAu THKSpeciment Location
177.2554.4313.975.35
276.0353.1614.008.35
379.2254.0814.246.35
Defects Inspection
FoundNO Found
1.Plating crack
2.Resion recession
3.Plating void
4.Delamination
5.Smear
6.Copper crack
7.Blistering
8.Interconnection separation
9.Laminate void
10.wicking
11.Nail Heading
Reliability Test Report
NO.ItemRequirementTest freqencyTest result
1Solderability test245±5℃ 5sec wetting area least 95%1ACC
2Thermal Stress288±5℃ 10sec, 3 cycles Check delamination Blistering,hole wall1ACC

Advantages

1.Avoid hassle: It’s an upset matter when quality problem hassling you. Bicheng engineering design prevents problem from occurring in pre-production. You will not get headache with Bicheng’s prototypes, small orders and volume production. Our rate of customer complaint is less than 1%

2.More than 15 years of experience.

3. Quick Lead time: 3-5 days.

4.Heavy copper PCB: Burden high current.


More Application

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Modem Wifi 3G
3G Wireless Router
Ac Dc Inverter


PCB Knowledge

Performance parameter of MCPCB substrate (The parameter will continue to be improved without notice)
Test itemUnitAluminum baseCopper baseIron baseTest method
Actual valeActual valeActual vale
Peel strengthN/mm2.222.34010 of GJB1651
Surface resistance1 x (10^6)1 x (10^6)1 x (10^6)5020 of GJB1651
Volume resistanceMΩ.m3.2 x (10^7)3.2 x (10^7)3.2 x (10^7)5020 of GJB1651
Breakdown voltageKV/min≥2.0 (Breakdown voltage is adjustable according to customers' demend)≥1.0 (Breakdown voltage is adjustable according to customers' demend)≥1.0 (Breakdown voltage is adjustable according to customers' demend)5040 of GJB1651
Solder dipping℃/min260℃, 3 minutes, no bubble and delamination260℃, 3 minutes, no bubble and delamination260℃, 3 minutes, no bubble and delamination4010 of GJB1651
Flammability-FV-0FV-0FV-017 of GB/T4722
Thermal resistance℃/W0.25-1.20.25-1.20.25-1.2TO-220
Dielectric constant-333(40℃,93%,96h)
Thermal conductivity of DielectricW/M.K0.8-80.8-3500.8-3ASTM 5470-D
Working temperature≤120≤120≤120(40℃,93%,1Y)
Thermal conductivity of metal baseW/M.K≥200≥350≥45ASTM


FAQ

How do you control the quality?
We believe engineering design prevents problems from occurring in preproduction. Our PCB and Manufacturing process are certified by authorized organizations.
100% tests are inclusive of electrical test and AOI inspection, high voltage test, impedance control test, micro-section, solder-ability test, thermal stress test,
reliability test, insulation resistance test and ionic contamination test etc.


Product Tags:

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2oz Each Layer 4 Layer PCB FR-4 ITEQ 2.4mm Thick Chemicla Gold Finish Images

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